We are supplier thermal pad in delh
Product descriptionThermal pad heat transfer between the heat-generating component (processor, micro-assembly, LED) and the heatsink.Also has dielectric properties, electrically insulating the heat sink from the component.The silicone base gives the material high elasticity, the backing fills well the microrelief of the matting surfaces.Aluminum nitride, which has excellent thermal conductivity, is used as a filler. Characteristics:
thickness: 3mm
sheet size: 400 x 200 mm
thermal conductivity: 1.5W/mK
dielectric constant: 4.5 kV/mm
operating temperature range: -50°C+200°C
linear elongation ratio: 1.48
